Yan Li,Deepak Goyal's 3D Microelectronic Packaging: From Fundamentals to PDF

By Yan Li,Deepak Goyal

This quantity presents a complete reference for graduate scholars and execs in either academia and at the basics, processing information, and purposes of 3D microelectronic packaging, an development for destiny microelectronic programs. Chapters written via specialists disguise the newest examine effects and development within the following parts: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, complex fabrics, warmth dissipation, thermal administration, thermal mechanical modeling, caliber, reliability, fault isolation, and failure research of 3D microelectronic applications. quite a few photos, tables, and didactic schematics are incorporated all through. This crucial quantity equips readers with an in-depth knowing of all elements of 3D packaging, together with packaging structure, processing, thermal mechanical and moisture similar reliability issues, universal disasters, constructing components, and destiny demanding situations, offering insights into key components for destiny study and development. 

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3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics) by Yan Li,Deepak Goyal

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